Jun Wang

City:

Lincoln, Nebraska

Country:

United States

Published Applications:

Last publication date:

2026-03-05

Top Assignees for applications by Jun Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Jun:

NUtech Ventures 3 Lincoln, NE United States
DREXEL UNIVERSITY 1 Philadelphia, PA United States
UNIVERSITY OF NEBRASKA 1 LINCOLN, NE United States

Recent patent applications by Wang Jun

Jun Wang from Lincoln, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-05

US20260068284A1

Electricity

POWER MODULE INTEGRATING SERIES- AND PARALLEL-CONNECTED SWITCH CHIPS

#2 | 2026-02-05

US20260039294A1

Electricity

HIGH-FREQUENCY PRESS-PACK SIC FIELD EFFECT TRANSISTOR (FET) MODULES

#3 | 2026-02-05

US20260036180A1

Mechanical engineering

MONOLITHIC SPRING ASSEMBLIES FOR HIGH-FREQUENCY PRESS-PACK MODULES

#4 | 2026-01-22

US20260025060A1

Electricity

ACTIVE RESONANCE MITIGATION METHODS FOR QUASI-TWO-LEVEL-BASED CONVERTERS

#5 | 2025-09-04

US20250279645A1

Electricity

INTEGRATED SOLID-STATE CIRCUIT BREAKER WITH SUPERCONDUCTING FAULT CURRENT LIMITER

#6 | 2024-03-14

US20240088800A1

Electricity

SWITCHING-CYCLE VOLTAGE DEVIATION CONTROL FOR MODULAR MULTILEVEL CONVERTERS

#7 | 2023-09-07

US20230283278A1

Electricity

POWER MODULES FOR CIRCUIT PROTECTION

#8 | 2021-04-15

US20210108988A1

Physics

Detecting faults in wind turbines

#9 | 2018-11-22

US20180335366A1

Physics

Detecting faults in wind turbines

InventorID:

2355039 ⎘