Inventor profile of:

Hui-Chi CHEN

City:

Hsinchu County

Country:

Taiwan

Published Applications:

35

Last publication date:

2025-11-13

Top Assignees for applications by Hui-Chi CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Hui-Chi:

Recent patent applications by CHEN Hui-Chi

Hui-Chi CHEN from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-13
US20250351562A1
Electricity

Metal Gate Electrode Formation Of Memory Devices

#2 | 2025-11-13
US20250351539A1
Electricity

POST GATE DIELECTRIC PROCESSING FOR SEMICONDUCTOR DEVICE FABRICATION

#3 | 2025-10-02
US20250311307A1
Electricity

FORMING LOW-RESISTANCE CAPPING LAYER OVER METAL GATE ELECTRODE

#4 | 2025-05-01
US20250140722A1
Electricity

SEMICONDUCTOR DEVICE HAVING A METAL PAD AND A PROTECTIVE LAYER FOR CORROSION PREVENTION DUE TO EXPOSURE TO HALOGEN

#5 | 2024-12-12
US20240413221A1
Electricity

INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY

#6 | 2024-11-14
US20240381608A1
Electricity

MULTI-LAYER HIGH-K GATE DIELECTRIC STRUCTURE

#7 | 2024-11-14
US20240379796A1
Electricity

Forming Low-Resistance Capping Layer Over Metal Gate Electrode

#8 | 2024-06-27
US20240213305A1
Electricity

METAL-INSULATOR-METAL STRUCTURE AND METHODS OF FABRICATION THEREOF

#9 | 2023-12-21
US20230411220A1
Electricity

POST GATE DIELECTRIC PROCESSING FOR SEMICONDUCTOR DEVICE FABRICATION

#10 | 2023-12-07
US20230395598A1
Electricity

Metal Gate Electrode Formation Of Memory Devices

#11 | 2023-11-30
US20230389256A1
Electricity

Multi-layer high-k gate dielectric structure

#12 | 2023-10-05
US20230317651A1
Electricity

Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogen

#13 | 2023-07-06
US20230215929A1
Electricity

Metal gate cap

#14 | 2023-03-02
US20230063857A1
Electricity

Integrated circuit device with improved reliability

#15 | 2023-01-12
US20230010952A1
Electricity

Forming Low-Resistance Capping Layer Over Metal Gate Electrode

#16 | 2022-12-01
US20220384454A1
Electricity

Multi-layer high-k gate dielectric structure

#17 | 2022-10-13
US20220328440A1
Electricity

Shielding structures

#18 | 2022-09-08
US20220285514A1
Electricity

Forming low-resistance capping layer over metal gate electrode

#19 | 2022-09-08
US20220285479A1
Electricity

Metal-insulator-metal structure and methods of fabrication thereof

#20 | 2022-09-01
US20220278218A1
Electricity

Metal gate cap

#21 | 2022-03-31
US20220102221A1
Electricity

Post gate dielectric processing for semiconductor device fabrication

#22 | 2021-10-21
US20210328005A1
Electricity

Metal-insulator-metal capacitive structure and methods of fabricating thereof

#23 | 2021-09-30
US20210305258A1
Electricity

Multi-layer high-k gate dielectric structure

#24 | 2021-04-01
US20210098399A1
Electricity

Prevention of metal pad corrosion due to exposure to halogen

#25 | 2021-03-25
US20210091029A1
Electricity

Shielding structures

#26 | 2020-12-31
US20200411377A1
Electricity

Semiconductor device and a method for fabricating the same

#27 | 2020-11-19
US20200365683A1
Electricity

Metal-insulator-metal structure and methods of fabrication thereof

#28 | 2020-05-28
US20200168574A1
Electricity

Shielding structures

#29 | 2020-04-02
US20200105863A1
Electricity

Metal-insulator-metal capacitive structure and methods of fabricating thereof

#30 | 2020-04-02
US20200105634A1
Electricity

Semiconductor structure with polyimide packaging and manufacturing method

#31 | 2020-01-30
US20200035779A1
Electricity

Metal-insulator-metal structure and methods of fabrication thereof

#32 | 2020-01-02
US20200006183A1
Electricity

Multi-layer passivation structure and method

#33 | 2019-04-11
US20190109211A1
Electricity

Semiconductor device and a method for fabricating the same

#34 | 2018-11-22
US20180337254A1
Electricity

Semiconductor device and method for fabricating the same

#35 | 2018-11-22
US20180337092A1
Electricity

Semiconductor device and a method for fabricating the same

InventorID:

2356366 ⎘