Hiroki Sudo

City:

Tochigi

Country:

Japan

Published Applications:

Last publication date:

2019-12-12

Top Assignees for applications by Hiroki Sudo

The entities that hold a legal rights for patent applications filed by inventor Sudo Hiroki:

Hiroki Sudo from Tochigi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Cu core ball, solder joint, solder paste and formed solder

Cu core ball, solder joint, solder paste and formed solder

Flux composition for solder applications

InventorID:

2358104 ⎘