Tokyo
Japan
15
2026-06-11
The entities that hold a legal rights for patent applications filed by inventor Fujimoto Daisuke:
Daisuke Fujimoto from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
WIRING FORMING MEMBER, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMED MEMBER
#2 | 2025-07-24RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
#3 | 2025-07-17PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
#4 | 2025-05-15MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER
#5 | 2025-05-01MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER
#6 | 2025-01-16WIRING-FORMING MEMBER, WIRING LAYER FORMING METHOD USING WIRING-FORMING MEMBER, AND WIRING-FORMED MEMBER
#7 | 2024-03-07ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE
#8 | 2023-12-07METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
#9 | 2023-03-30METHOD FOR USING A BUFFER SHEET
#10 | 2021-01-21Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device
#11 | 2020-12-24Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
#12 | 2020-06-18Method for producing semiconductor device
#13 | 2019-08-01Roof ditch molding end cap
#14 | 2018-11-29BUFFER SHEET COMPOSITION AND BUFFER SHEET
#15 | 2017-03-16Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
2358727 ⎘