Inventor profile of:

Grant Wagner

City:

Jericho, Vermont

Country:

United States

Published Applications:

18

Last publication date:

2026-03-05

Top Assignees for applications by Grant Wagner

The entities that hold a legal rights for patent applications filed by inventor Wagner Grant:

Recent patent applications by Wagner Grant

Grant Wagner from Jericho, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-05
US20260063666A1
Physics

FINE-PITCH PROBING SHIELD

#2 | 2026-02-05
US20260040899A1
Electricity

SILICON INTERPOSER WITH INTEGRATED FINE-PITCH WAFER TEST PROBES

#3 | 2024-06-27
US20240213217A1
Electricity

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

#4 | 2024-06-06
US20240183880A1
Physics

Clustered rigid wafer test probe

#5 | 2023-06-01
US20230168301A1
Physics

Compliant wafer probe assembly

#6 | 2023-03-23
US20230089411A1
Physics

Wafer probe with elastomer support

#7 | 2021-03-18
US20210082860A1
Electricity

Interconnect and tuning thereof

#8 | 2021-03-18
US20210080486A1
Physics

Compliant organic substrate assembly for rigid probes

#9 | 2020-12-10
US20200386785A1
Physics

Fluidized alignment of a semiconductor die to a test probe

#10 | 2020-09-17
US20200292577A1
Physics

Electrochemical cleaning of test probes

#11 | 2020-07-02
US20200209308A1
Physics

Integrated circuit tester probe contact liner

#12 | 2019-11-21
US20190353702A1
Physics

Integrated circuit tester probe contact liner

#13 | 2019-07-25
US20190227100A1
Physics

PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STRUCTURES

#14 | 2018-12-13
US20180358323A1
Electricity

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

#15 | 2018-12-13
US20180358322A1
Electricity

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

#16 | 2018-12-13
US20180358321A1
Electricity

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

#17 | 2018-11-29
US20180340959A1
Physics

PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STRUCTURES

#18 | 2018-11-29
US20180340958A1
Physics

Low-force wafer test probes

InventorID:

2359571 ⎘