Inventor profile of:

Burton Jesse CARPENTER

City:

AUSTIN, Texas

Country:

United States

Published Applications:

16

Last publication date:

2026-06-04

Top Assignees for applications by Burton Jesse CARPENTER

The entities that hold a legal rights for patent applications filed by inventor CARPENTER Burton Jesse:

Recent patent applications by CARPENTER Burton Jesse

Burton Jesse CARPENTER from AUSTIN, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-04
US20260157187A1
Electricity

GICL PACKAGE STRUCTURE WITH IMPROVED COMMUNICATION

#2 | 2024-11-14
US20240380307A1
Electricity

SYSTEM COMPRISING A GATE DRIVER

#3 | 2024-10-03
US20240332105A1
Electricity

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

#4 | 2023-06-22
US20230197645A1
Electricity

Radio frequency packages containing multilevel power substrates and associated fabrication methods

#5 | 2023-03-16
US20230085441A1
Electricity

SEMICONDUCTOR DEVICE HAVING GALVANIC ISOLATION AND METHOD THEREFOR

#6 | 2022-09-08
US20220285330A1
Electricity

Semiconductor device package having galvanic isolation and method therefor

#7 | 2022-03-31
US20220102292A1
Electricity

Semiconductor device package having galvanic isolation and method therefor

#8 | 2022-03-24
US20220093416A1
Electricity

Tie bar removal for semiconductor device packaging

#9 | 2021-07-01
US20210202267A1
Electricity

Tie bar removal for semiconductor device packaging

#10 | 2021-03-04
US20210066217A1
Electricity

Packaged integrated circuit having stacked die and method for making

#11 | 2020-06-25
US20200203289A1
Electricity

Lead reduction for improved creepage distance

#12 | 2020-06-25
US20200203262A1
Electricity

Hybrid lead frame for semiconductor die package with improved creepage distance

#13 | 2020-01-23
US20200027823A1
Electricity

Packaged integrated circuit having stacked die and method for therefor

#14 | 2019-03-21
US20190088576A1
Electricity

Packaged integrated circuit having stacked die and method for therefor

#15 | 2019-02-28
US20190067172A1
Electricity

Packaged semiconductor device and method for forming

#16 | 2018-11-29
US20180342444A1
Electricity

Packaged integrated circuit device and methods

InventorID:

2360652 ⎘