Boise, Idaho
United States
22
2024-12-26
The entities that hold a legal rights for patent applications filed by inventor McClain Benjamin L.:
Benjamin L. McClain from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCTURES
#2 | 2023-06-22Methods and systems for manufacturing semiconductor devices
#3 | 2021-07-29Thermocompression bond tips and related apparatus and methods
#4 | 2021-07-22Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#5 | 2021-06-24Semiconductor device assembly with surface-mount die support structures
#6 | 2021-06-17Method for solder bridging elimination for bulk solder C2S interconnects
#7 | 2021-04-15Method for Substrate Moisture NCF Voiding Elimination
#8 | 2021-03-25Methods and systems for manufacturing semiconductor devices
#9 | 2021-03-11Methods and systems for manufacturing semiconductor devices
#10 | 2020-07-02Methods and systems for manufacturing semiconductor devices
#11 | 2020-07-02Methods and systems for manufacturing semiconductor devices
#12 | 2020-04-09Method for stress reduction in semiconductor package via carrier
#13 | 2019-10-24Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#14 | 2019-08-15Method for substrate moisture NCF voiding elimination
#15 | 2019-07-04Method for stress reduction in semiconductor package via carrier
#16 | 2019-05-02Method for 3D ink jet TCB interconnect control
#17 | 2019-02-28Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool
#18 | 2019-02-28Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
#19 | 2019-02-28Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#20 | 2018-12-20Thermocompression bond tips and related apparatus and methods
#21 | 2018-11-29Semiconductor device assembly with surface-mount die support structures
#22 | 2018-10-02Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
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