John Szczech

City:

Itasca, Illinois

Country:

United States

Published Applications:

Last publication date:

2026-05-14

Top Assignees for applications by John Szczech

The entities that hold a legal rights for patent applications filed by inventor Szczech John:

John Szczech from Itasca, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MICRO-ELECTRO-MECHANICAL SYSTEMS MICROPHONE WITH INCREASED BACK VOLUME

Microphone package

Microphone package

Microphone package for fully encapsulated ASIC and wires

InventorID:

2361288 ⎘