Inventor profile of:

Li-Chieh Wu

City:

Hsinchu

Country:

Taiwan

Published Applications:

30

Last publication date:

2026-05-21

Top Assignees for applications by Li-Chieh Wu

The entities that hold a legal rights for patent applications filed by inventor Wu Li-Chieh:

Recent patent applications by Wu Li-Chieh

Li-Chieh Wu from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-21
US20260144031A1
Electricity

METHODS OF FORMING AN ABRASIVE SLURRY AND METHODS FOR CHEMICAL-MECHANICAL POLISHING

#2 | 2025-01-30
US20250038008A1
Electricity

METHODS FOR CHEMICAL MECHANICAL POLISHING AND METHODS FOR FORMING AN INTERCONNECT STRUCTURE OF A SEMICONDUCTOR DEVICE

#3 | 2023-10-05
US20230317519A1
Electricity

Metal loss prevention using implantation

#4 | 2023-03-16
US20230082084A1
Electricity

Methods for chemical mechanical polishing and forming interconnect structure

#5 | 2022-12-01
US20220384245A1
Electricity

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing

#6 | 2022-12-01
US20220384244A1
Electricity

Polishing interconnect structures in semiconductor devices

#7 | 2022-11-10
US20220359189A1
Electricity

Method for metal gate surface clean

#8 | 2022-04-21
US20220122884A1
Electricity

Metal loss prevention using implantation

#9 | 2021-12-16
US20210391208A1
Electricity

Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure

#10 | 2021-12-16
US20210391186A1
Electricity

Methods for chemical mechanical polishing and forming interconnect structure

#11 | 2021-12-02
US20210371702A1
Chemistry; metallurgy

Slurry composition and method for polishing and integrated circuit

#12 | 2021-08-19
US20210257248A1
Electricity

Polishing interconnect structures in semiconductor devices

#13 | 2021-07-08
US20210210383A1
Electricity

Structure and formation method of semiconductor device with conductive feature

#14 | 2021-06-17
US20210183688A1
Electricity

Methods of forming an abrasive slurry and methods for chemical- mechanical polishing

#15 | 2021-03-18
US20210082688A1
Electricity

Method for metal gate surface clean

#16 | 2020-04-16
US20200118823A1
Electricity

Systems and methods for chemical mechanical polish and clean

#17 | 2020-04-02
US20200105580A1
Electricity

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

#18 | 2020-02-13
US20200051855A1
Electricity

Method of cleaning wafer after CMP

#19 | 2020-02-06
US20200043786A1
Electricity

Structure and formation method of semiconductor device with conductive feature

#20 | 2019-12-19
US20190385909A1
Electricity

Metal loss prevention using implantation

#21 | 2019-12-05
US20190371664A1
Electricity

Metal loss prevention using implantation

#22 | 2018-12-06
US20180350675A1
Electricity

Method of cleaning wafer after CMP

#23 | 2018-01-02
US15223068
Electricity

Planarization process for forming semiconductor device structure

#24 | 2017-08-03
US20170221700A1
Electricity

Method for metal gate surface clean

#25 | 2017-01-05
US20170004972A1
Electricity

Systems and methods for chemical mechanical polish and clean

#26 | 2016-06-16
US20160172186A1
Electricity

Method for metal gate surface clean

#27 | 2015-10-15
US20150295063A1
Electricity

Mechanism for forming metal gate structure

#28 | 2015-07-16
US20150200089A1
Electricity

Method for cleaning metal gate surface

#29 | 2015-06-25
US20150179432A1
Electricity

Methods and systems for chemical mechanical polish and clean

#30 | 2014-12-18
US20140367801A1
Electricity

Mechanism for forming metal gate structure

InventorID:

2367565 ⎘