Hideki Usami

City:

Aichi-gun

Country:

Japan

Published Applications:

Last publication date:

2018-12-13

Top Assignees for applications by Hideki Usami

The entities that hold a legal rights for patent applications filed by inventor Usami Hideki:

Hideki Usami from Aichi-gun, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermoforming device and thermoforming method

Thermoforming device and thermoforming method using hot plate heating

Method of cutting multilayer body, method of forming multilayer container, and multilayer formed product

InventorID:

2370170 ⎘