Ellwangen
Germany
27
2026-04-23
The entities that hold a legal rights for patent applications filed by inventor FOCA Eugen:
Eugen FOCA from Ellwangen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD AND APPARATUS FOR CHARGE COMPENSATION DURING 3D TOMOGRAPHY
#2 | 2025-11-273D VOLUME INSPECTION METHOD AND METHOD OF CONFIGURING OF A 3D VOLUME INSPECTION METHOD
#3 | 2025-11-20METHODS OF CROSS-SECTION IMAGING OF AN INSPECTION VOLUME IN A WAFER
#4 | 2025-08-28SENSOR FUSION FOR THIN FILM SEGMENTATION
#5 | 2025-07-24CONTACT AREA SIZE DETERMINATION BETWEEN 3D STRUCTURES IN AN INTEGRATED SEMICONDUCTOR SAMPLE
#6 | 2025-07-03COMPUTER IMPLEMENTED METHOD FOR DEFECT DETECTION IN AN IMAGING DATASET OF A WAFER, CORRESPONDING COMPUTER-READABLE MEDIUM, COMPUTER PROGRAM PRODUCT AND SYSTEMS MAKING USE OF SUCH METHODS
#7 | 2025-05-22METHOD FOR DISTORTION MEASUREMENT AND PARAMETER SETTING FOR CHARGED PARTICLE BEAM IMAGING DEVICES AND CORRESPONDING DEVICES
#8 | 2025-02-27DUAL BEAM SYSTEMS AND METHODS FOR DECOUPLING THE WORKING DISTANCE OF A CHARGED PARTICLE BEAM DEVICE FROM FOCUSED ION BEAM GEOMETRY INDUCED CONSTRAINTS
#9 | 2025-01-163D VOLUME INSPECTION OF SEMICONDUCTOR WAFERS WITH INCREASED THROUGHPUT AND ACCURACY
#10 | 2024-10-033D VOLUME INSPECTION OF SEMICONDUCTOR WAFERS WITH INCREASED ACCURACY
#11 | 2024-10-03METHOD OF 3D VOLUME INSPECTION OF SEMICONDUCTOR WAFERS WITH INCREASED THROUGHPUT
#12 | 2024-09-19MEASUREMENT METHOD AND APPARATUS FOR SEMICONDUCTOR FEATURES WITH INCREASED THROUGHPUT
#13 | 2024-09-12ELECTRON MICROSCOPE FOR EXAMINING A SPECIMEN
#14 | 2024-08-223D VOLUME INSPECTION METHOD AND METHOD OF CONFIGURING OF A 3D VOLUME INSPECTION METHOD
#15 | 2024-02-01Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
#16 | 2023-10-26Parameterizing x-ray scattering measurement using slice-and-image tomographic imaging of semiconductor structures
#17 | 2023-08-24TRANSFERRING ALIGNMENT INFORMATION IN 3D TOMOGRAPHY FROM A FIRST SET OF IMAGES TO A SECOND SET OF IMAGES
#18 | 2023-06-22MEASUREMENT METHOD AND APPARATUS FOR SEMICONDUCTOR FEATURES WITH INCREASED THROUGHPUT
#19 | 2023-06-08Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
#20 | 2023-04-20Method for measuring a sample and microscope implementing the method
#21 | 2022-12-08METHODS OF CROSS-SECTION IMAGING OF AN INSPECTION VOLUME IN A WAFER
#22 | 2022-07-21Contact area size determination between 3D structures in an integrated semiconductor sample
#23 | 2022-07-14FIB-SEM 3D tomography for measuring shape deviations of HAR structures
#24 | 2022-05-05CROSS SECTION IMAGING WITH IMPROVED 3D VOLUME IMAGE RECONSTRUCTION ACCURACY
#25 | 2021-04-01Automated root cause analysis for defect detection during fabrication processes of semiconductor structures
#26 | 2020-09-10Method and devices for determining metrology sites
#27 | 2018-12-27Projection exposure apparatus and method for measuring a projection lens
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