Tomoyuki AOKI

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2022-03-31

Top Assignees for applications by Tomoyuki AOKI

The entities that hold a legal rights for patent applications filed by inventor AOKI Tomoyuki:

Tomoyuki AOKI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermosetting resin composition, resin sheet, laminate, and printed wiring board

Multilayer printed wiring board and multilayer metal clad laminated board

InventorID:

2388706 ⎘