Inventor profile of:

Jochen KUHMANN

City:

Berlin

Country:

Germany

Published Applications:

15

Last publication date:

2019-12-19

Top Assignees for applications by Jochen KUHMANN

The entities that hold a legal rights for patent applications filed by inventor KUHMANN Jochen:

Recent patent applications by KUHMANN Jochen

Jochen KUHMANN from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-12-19
US20190382159A1
Performing operations; transporting

Pallet having panels and tube segments

#2 | 2019-12-12
US20190375544A1
Performing operations; transporting

Pallet comprising folded wooden composite

#3 | 2019-07-11
US20190210316A1
Performing operations; transporting

Construction element having cover plates and tube segments made of a wood-based material

#4 | 2019-06-13
US20190177037A1
Performing operations; transporting

Pallet having panels and tube segments

#5 | 2019-01-03
US20190001609A1
Performing operations; transporting

Web, sandwich plate, sandwich block and methods for producing same

#6 | 2011-02-24
US20110045618A1
Electricity

Fabrication of compact opto-electronic component packages

#7 | 2010-08-19
US20100210045A1
Electricity

Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts

#8 | 2010-08-12
US20100200888A1
Electricity

Silicon-based sub-mount for an opto-electronic device

#9 | 2009-12-31
US20090321760A1
Electricity

Fabrication of compact opto-electronic component packages

#10 | 2009-07-16
US20090181500A1
Electricity

Fabrication of Compact Semiconductor Packages

#11 | 2008-12-25
US20080315390A1
Performing operations; transporting

Chip Scale Package For A Micro Component

#12 | 2007-12-20
US20070292127A1
Physics

Small form factor camera module with lens barrel and image sensor

#13 | 2007-05-31
US20070120041A1
Electricity

Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same

#14 | 2007-02-15
US20070035001A1
Performing operations; transporting

Method of fabrication for chip scale package for a micro component

#15 | 2005-10-27
US20050236562A1
Performing operations; transporting

Assembly with self-alignment features to position a cover on a substrate that supports a micro component

InventorID:

2390147 ⎘