Tokyo
Japan
18
2025-11-06
The entities that hold a legal rights for patent applications filed by inventor TAKEI Kunihiro:
Kunihiro TAKEI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
LAMINATE
#2 | 2025-08-14ADHESIVE-EQUIPPED METAL SUBSTRATE AND LAMINATE
#3 | 2025-06-05ADHESIVE FILM AND METHOD FOR PRODUCING ADHESIVE FILM
#4 | 2025-05-15ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE
#5 | 2025-01-02HOT-MELT ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE RESIN LAMINATE
#6 | 2024-08-15Adhesive Film And Method For Producing Adhesive Film
#7 | 2022-09-01Adhesive resin composition, method for bonding adherends, and adhesive resin film
#8 | 2022-04-14Adhesive resin composition and laminate
#9 | 2022-02-17Hot-melt adhesive resin composition and hot-melt adhesive resin laminate
#10 | 2022-01-06Hot-melt adhesive resin film and production method thereof
#11 | 2021-07-01Electrode lead wire member and battery
#12 | 2021-01-14Hot-melt adhesive resin film and production method thereof
#13 | 2019-08-08Electrode lead wire member and battery
#14 | 2019-02-28Adhesive resin composition and laminate
#15 | 2019-02-28Adhesive resin composition and laminate
#16 | 2019-01-31Adhesive resin composition, method for bonding adherends, and adhesive resin film
#17 | 2019-01-03Hot-melt adhesive resin film and production method thereof
#18 | 2019-01-03Hot-melt adhesive resin film and production method thereof
2390160 ⎘