Sujun JIANG

City:

Guangdong

Country:

China

Published Applications:

Last publication date:

2025-05-01

Top Assignees for applications by Sujun JIANG

The entities that hold a legal rights for patent applications filed by inventor JIANG Sujun:

KINGFA SCI. & TECH. CO., LTD. 7 Guangdong, China
ZHUHAI VANTEQUE SPECIALTY ENGINEERING PLASTICS CO., LTD. 7 Guangdong, China
KINGFA SCI. & TECH. CO., LTD. 3 Guangdong, China
SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD 1 , China
KINGFA SCI & TECH CO. LTD. 1 , China
KINGFA SCI & TECH CO LTD. 1 Guangzhou, Guangdong, China
SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD. 1 Shanghai, China
SHANGHAI KINGFA SCI. & TECH. DVPT. CO., LTD. 1 Shanghai, China
SHANGHAI KINGFA SCI. & TECH. DVPT. CO., LTD. 1 Shanghai, China

Recent patent applications by JIANG Sujun

Sujun JIANG from Guangdong, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-01

US20250136807A1

Chemistry; metallurgy

POLYESTER RESIN COMPOSITION, PREPARATION METHOD THEREOF AND USE THEREOF

#2 | 2024-12-26

US20240425668A1

Chemistry; metallurgy

PA10T MOLDING COMPOSITE MATERIAL, AND PREPARATION METHOD THEREFOR AND USE THEREOF

#3 | 2024-11-28

US20240392070A1

Chemistry; metallurgy

FURAN DIACID-BASED POLYAMIDE RESIN, PREPARATION METHOD THEREOF, AND POLYAMIDE MOLDING COMPOSITION

#4 | 2024-11-21

US20240384060A1

Chemistry; metallurgy

POLYAMIDE MOLDING COMPOSITE MATERIAL, AND PREPARATION METHOD THEREFOR AND APPLICATION THEREOF

#5 | 2024-11-21

US20240384033A1

Chemistry; metallurgy

FURAN DIACID-BASED POLYAMIDE, PREPARATION METHOD THEREFOR, AND FURAN DIACID-BASED POLYAMIDE COMPOSITION

#6 | 2022-08-11

US20220251297A1

Chemistry; metallurgy

IN SITU POLYMERIZED FLAME RETARDANT, PREPARATION METHOD THEREOF, AND MOLDING COMPOSITION COMPRISING THEREOF

#7 | 2019-01-03

US20190002639A1

Chemistry; metallurgy

Semiaromatic copolyamide resin and polyamide molding composition consisting of the same

#8 | 2019-01-03

US20190002638A1

Chemistry; metallurgy

SEMIAROMATIC POLYAMIDE RESIN AND PREPARATION METHOD THEREOF AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF THE SAME

#9 | 2014-10-09

US20140303293A1

Chemistry; metallurgy

Heat-resistant polyamide composition and application thereof

InventorID:

2391174 ⎘