Benjamin Haag

City:

Horgen

Country:

Switzerland

Published Applications:

Last publication date:

2019-01-10

Top Assignees for applications by Benjamin Haag

The entities that hold a legal rights for patent applications filed by inventor Haag Benjamin:

DOW GLOBAL TECHNOLOGIES LLC 1 Midland, MI United States

Recent patent applications by Haag Benjamin

Benjamin Haag from Horgen, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-01-10

US20190010373A1

Chemistry; metallurgy

One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same

InventorID:

2397505 ⎘