Tianjin
China
10
2013-05-30
The entities that hold a legal rights for patent applications filed by inventor LIU Yuling:
Yuling LIU from Tianjin, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF CLEANING TUNGSTEN PLUG SURFACES IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER CHEMICAL-MECHANICAL POLISHING
#2 | 2013-05-16Method of cleaning copper material surfaces in ultra large scale integrated circuits after polishing the same
#3 | 2013-05-16METHOD OF CLEANING MULTILAYER COPPER WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER CHEMICAL-MECHANICAL POLISHING
#4 | 2012-12-20METHOD OF PREVENTING OXIDATION OF MULTILAYER WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER ALKALINE POLISHING
#5 | 2012-12-20METHOD OF CLEANING WAFER SURFACES AFTER POLISHING ALUMINUM WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS
#6 | 2012-12-13Method of polishing copper wiring surfaces in ultra large scale integrated circuits
#7 | 2008-02-07METHOD FOR CONTROLLING THE DISHING PROBLEM ASSOCIATED WITH CHEMICAL-MECHANICAL PLANARIZATION (CMP) DURING MANUFACTURE OF COPPER MULTILAYER INTERCONNECTION STRUCTURES IN ULTRA LARGE-SCALE INTEGRATED CIRCUITS (ULSI)
#8 | 2007-12-27Method of eliminating surface stress of silicon wafer
#9 | 2007-12-06Slurry for chemical-mechanical planarization of sapphire and method for manufacturing the same
#10 | 2007-12-06Method for removing contaminants from silicon wafer surface
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