KAI Herbst

City:

Erlangen

Country:

Germany

Published Applications:

Last publication date:

2021-06-24

Top Assignees for applications by KAI Herbst

The entities that hold a legal rights for patent applications filed by inventor Herbst KAI:

KAI Herbst from Erlangen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

COPPER-CERAMIC COMPOSITE

Copper/ceramic composite

LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

Copper-ceramic composite

Copper-ceramic composite

Copper-ceramic composite

COPPER-CERAMIC COMPOSITE

InventorID:

2408166 ⎘