Osaka
Japan
17
2022-11-17
The entities that hold a legal rights for patent applications filed by inventor ISHIKAWA RYO:
RYO ISHIKAWA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Laser processing head and laser processing system using same
#2 | 2022-10-20LASER DEVICE, AND LASER PROCESSING DEVICE IN WHICH SAME IS USED
#3 | 2022-06-09LASER DEVICE
#4 | 2021-03-04Laser device and laser processing device using same
#5 | 2020-12-31Laser oscillator, laser machining device in which same is used, and laser oscillation method
#6 | 2020-09-10Laser processing head and laser processing system using same
#7 | 2020-07-09PROCESS FIBER AND LASER PROCESSING SYSTEM IN WHICH SAME IS USED
#8 | 2020-06-25Laser device
#9 | 2020-06-25LASER PROCESSING HEAD, OPTICAL FIBER INSPECTION DEVICE, AND OPTICAL FIBER INSPECTION METHOD
#10 | 2019-11-21Core adjustment method
#11 | 2019-11-21Laser processing head and laser processing device using same
#12 | 2019-09-26Alignment method
#13 | 2019-09-12Fiber coupling device
#14 | 2019-09-05Laser device
#15 | 2019-08-29Laser processing device and laser processing method
#16 | 2019-02-28FIBER SPATIAL COUPLING DEVICE
#17 | 2019-01-31Fiber coupling device
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