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Inventor profile of:

AUDEL SANCHEZ

City:

Tempe, Arizona

Country:

United States

Published Applications:

11

Last publication date:

2021-07-15

Top Assignees for applications by AUDEL SANCHEZ

The entities that hold a legal rights for patent applications filed by inventor SANCHEZ AUDEL:

NXP USA, INC. 11 AUSTIN, TX United States

Recent patent applications by SANCHEZ AUDEL

AUDEL SANCHEZ from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-07-15

US20210217685A1

Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

#2 | 2020-07-02

US20200211932A1

Internally-shielded microelectronic packages and methods for the fabrication thereof

#3 | 2020-03-05

US20200075463A1

Internally-shielded microelectronic packages and methods for the fabrication thereof

#4 | 2020-01-16

US20200020614A1

Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

#5 | 2019-11-07

US20190343005A1

Packaged electronic devices with top terminations

#6 | 2019-04-11

US20190109060A1

Molded air cavity packages and methods for the production thereof

#7 | 2019-02-14

US20190051571A1

Molded air cavity packages and methods for the production thereof

#8 | 2019-02-07

US20190043775A1

Molded air cavity packages and methods for the production thereof

#9 | 2019-02-07

US20190043774A1

Molded air cavity packages and methods for the production thereof

#10 | 2019-01-31

US20190033365A1

Die crack detector and method therefor

#11 | 2018-11-27

US15649799

Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or features

InventorID:

2416405 ⎘