Ryosuke OKI

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2019-09-12

Top Assignees for applications by Ryosuke OKI

The entities that hold a legal rights for patent applications filed by inventor OKI Ryosuke:

Ryosuke OKI from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Die, manufacturing method therefor, and molded body manufacturing method

Foamed structure, resin panel, method of manufacturing resin panel, method of manufacturing resin laminated body and foamed body

Foamed structure and resin panel

InventorID:

2420789 ⎘