Hitachi
Japan
15
2014-07-17
The entities that hold a legal rights for patent applications filed by inventor Ide Eiichi:
Eiichi Ide from Hitachi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor module and method for manufacturing semiconductor module
#2 | 2013-11-14Semiconductor device and method for manufacturing same
#3 | 2013-10-17Power module and lead frame for power module
#4 | 2013-07-11Power semiconductor module and manufacturing method thereof
#5 | 2013-05-16CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
#6 | 2012-05-03LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
#7 | 2011-08-25Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#8 | 2011-01-20Semiconductor device and method of manufacturing the same
#9 | 2010-10-28Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
#10 | 2010-08-05Electronic member, electronic part and manufacturing method therefor
#11 | 2009-10-01Semiconductor device and bonding material
#12 | 2008-10-02Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
#13 | 2008-07-24Low temperature bonding material comprising metal particles and bonding method
#14 | 2008-07-03CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME
#15 | 2008-07-03Bonding method and bonding material using metal particle
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