Hitachi
Japan
13
2013-05-16
The entities that hold a legal rights for patent applications filed by inventor Yasuda Yusuke:
Yusuke Yasuda from Hitachi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
#2 | 2012-05-03LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
#3 | 2011-08-25Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#4 | 2011-06-30SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5 | 2011-01-20Semiconductor device and method of manufacturing the same
#6 | 2010-08-05Electronic member, electronic part and manufacturing method therefor
#7 | 2009-10-01Semiconductor device and bonding material
#8 | 2009-07-16Interconnect material and interconnect formation method
#9 | 2008-10-02Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
#10 | 2008-07-24Low temperature bonding material comprising metal particles and bonding method
#11 | 2008-07-03CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME
#12 | 2008-07-03Bonding method and bonding material using metal particle
#13 | 2007-12-27BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
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