Underhill, Vermont
United States
44
2018-04-05
The entities that hold a legal rights for patent applications filed by inventor LUCE Stephen E.:
Stephen E. LUCE from Underhill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of manufacturing MEMS switches with reduced switching voltage
#2 | 2018-03-08Method of manufacturing MEMS switches with reduced switching voltage
#3 | 2018-01-18Methods of manufacturing for MEMS switches with reduced switching voltage
#4 | 2018-01-18Methods of manufacture for MEMS switches with reduced switching voltage
#5 | 2017-10-12Method of manufacturing a switch
#6 | 2016-05-26Method of manufacturing a switch
#7 | 2016-02-04Method of manufacture MEMS switches with reduced voltage
#8 | 2016-02-04Method of manufacturing MEMS switches with reduced voltage
#9 | 2016-02-04Method of manufacturing MEMS switches with reduced switching voltage
#10 | 2016-02-04Method of manufacturing MEMS switches with reduced switching volume
#11 | 2015-09-03Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure
#12 | 2015-07-16MEMS switches with reduced switching voltage and methods of manufacture
#13 | 2015-02-12Field effect transistor and method of manufacture
#14 | 2014-08-14Lateral extended drain metal oxide semiconductor field effect transistor (LEDMOSFET) with tapered airgap field plates
#15 | 2014-04-03Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
#16 | 2014-01-16Charge breakdown avoidance for MIM elements in SOI base technology and method
#17 | 2014-01-09Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure
#18 | 2013-08-01MEMS switches with reduced switching voltage and methods of manufacture
#19 | 2013-07-11Double-sided integrated circuit chips
#20 | 2013-05-16Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
#21 | 2013-05-16Methods of manufacturing integrated semiconductor devices with single crystalline beam
#22 | 2012-02-16Structure having substantially parallel resistor material lengths
#23 | 2011-09-15Charge breakdown avoidance for MIM elements in SOI base technology and method
#24 | 2010-09-30Self-Aligned Chip Stacking
#25 | 2010-09-30Horizontal micro-electro-mechanical-system switch
#26 | 2009-10-22MEMS switches with reduced switching voltage and methods of manufacture
#27 | 2009-10-08Field effect transistor and method of manufacture
#28 | 2009-09-17Resistor and design structure having substantially parallel resistor material lengths
#29 | 2009-09-17Resistor and design structure having resistor material length with sub-lithographic width
#30 | 2009-09-17Charge breakdown avoidance for MIM elements in SOI base technology and method
#31 | 2009-05-14Stacked imager package
#32 | 2009-04-02Three dimensional vertical E-fuse structures and methods of manufacturing the same
#33 | 2008-05-22CMOS imager array with recessed dielectric
#34 | 2008-04-17Stacked imager package
#35 | 2008-03-27Stacked imager package
#36 | 2008-03-13Crack stop for low K dielectrics
#37 | 2006-08-08Copper to aluminum interlayer interconnect using stud and via liner
#38 | 2006-07-27Bilayer aluminum last metal for interconnects and wirebond pads
#39 | 2006-05-11Crack stop for low K dielectrics
#40 | 2006-05-02Copper to aluminum interlayer interconnect using stud and via liner
#41 | 2006-02-09Exposed pore sealing post patterning
#42 | 2005-12-01Exposed pore sealing post patterning
#43 | 2005-11-03METHOD AND STRUCTURE FOR CONNECTING GROUND/POWER NETWORKS TO PREVENT CHARGE DAMAGE IN SILICON ON INSULATOR
#44 | 2005-02-03CRACK STOP FOR LOW K DIELECTRICS
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