Christopher D. Muzzy

Lead-free column interconnect

Lead-free solder joining of electronic structures

Non-porous copper to copper interconnect

Conductive pillar shaped for solder confinement

Conductive pillar shaped for solder confinement

Corrosion resistant aluminum bond pad structure

Non-porous copper to copper interconnect

Lead-free solder joining of electronic structures

Mixed UBM and mixed pitch on a single die

Continuous modification of organics in chemical baths

Corrosion resistant aluminum bond pad structure

Photonics chip

Structures and methods to enable a full intermetallic interconnect

Continuous modification of organics in chemical baths

Determining crackstop strength of integrated circuit assembly at the wafer level

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Mixed UBM and mixed pitch on a single die

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Photonics chip

Structures and methods to enable a full intermetallic interconnect

Structures to enable a full intermetallic interconnect

Nanowires for pillar interconnects

NANOWIRES FOR PILLAR INTERCONNECTS

Nanowires for pillar interconnects

Extrusion-resistant solder interconnect structures and methods of forming

Barrier structures for underfill blockout regions

Conductive pillar shaped for solder confinement

Corrosion resistant aluminum bond pad structure

Conductive pillar shaped for solder confinement

Passivation layer topography

Preventing misshaped solder balls

Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop

PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

Method of forming an integrated crackstop

Structure to prevent solder extrusion

Plug via formation with grid features in the passivation layer

Plug via formation by patterned plating and polishing

PREVENTING MISSHAPED SOLDER BALLS

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

Semiconductor test and monitoring structure to detect boundaries of safe effective modulus

Structures and methods for improving solder bump connections in semiconductor devices

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Semiconductor structures and methods of manufacture

Solder bump connection and method of making

Dice before grind with backside metal

Far back end of the line metallization method and structures

Semiconductor test wafer and methods for use thereof

Capacitor using barrier layer metallurgy

Thermal via for 3D integrated circuits structures

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package

Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop

Extrusion-resistant solder interconnect structures and methods of forming

Wire bond splash containment

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Semiconductor test and monitoring structure to detect boundaries of safe effective modulus

Semiconductor structures and methods of manufacture

Self-aligned polymer passivation/aluminum pad

Structures and methods for detecting solder wetting of pedestal sidewalls

Pillar interconnect chip to package and global wiring structure

Solder bump connections

Underfill flow guide structures and method of using same

Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump

Buffer pad in solder bump connections and methods of manufacture

Polymer and solder pillars for connecting chip and carrier

Ni plating of a BLM edge for Pb-free C4 undercut control

Solder bump connections

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Ni plating of a BLM edge for Pb-free C4 undercut control

Underfill flow guide structures and method of using same

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Chip package solder interconnect formed by surface tension

Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate

Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Damage propagation barrier

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods to improve lead-free C4 interconnect reliability

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods for improving solder bump connections in semiconductor devices

Methods of forming solder connections and structure thereof

Underfill flow guide structures

Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining

Structure, failure analysis tool and method of determining white bump location using failure analysis tool

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

OPTIMIZED PASSIVATION SLOPE FOR SOLDER CONNECTIONS

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Fine pitch solder bump structure with built-in stress buffer

Undercut-free BLM process for Pb-free and Pb-reduced C4

Wire bond pads

Method of creating contour structures to highlight inspection region

Undercut-free BLM process for Pb-free and Pb-reduced C4

Programming of laser fuse

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

Wire and solder bond forming methods