Sayuri Hada

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-05-28

Top Assignees for applications by Sayuri Hada

The entities that hold a legal rights for patent applications filed by inventor Hada Sayuri:

Sayuri Hada from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

CO-PACKAGED OPTICAL MODULES

ORGANIC SUBSTRATE FOR CO-PACKAGED OPTICS

Method of reducing warpage of an organic substrate

Method of reducing warpage of an orgacnic substrate

Reduction of warpage of multilayered substrate or package

Reduction of warpage of multilayered substrate or package

Mounting structure and mounting structure manufacturing method

METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS

InventorID:

242521 ⎘