Flower Mound, Texas
United States
63
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Manack Christopher Daniel:
Christopher Daniel Manack from Flower Mound, US has applied for patents for these inventions. The list has both pending applications and granted patents:
COATED SEMICONDUCTOR DIES
#2 | 2026-04-30LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTRONIC DEVICE
#3 | 2025-12-04INDUCTOR MODULE WITH PACKAGED SEMICONDUCTOR DIE
#4 | 2025-12-04EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING
#5 | 2025-07-03ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
#6 | 2025-05-22MINIATURE SENSOR CAVITIES
#7 | 2025-01-23EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
#8 | 2024-12-19DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELECTRONIC DEVICES
#9 | 2024-12-12CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
#10 | 2024-07-11Electronic devices in semiconductor package cavities
#11 | 2024-02-15COATED SEMICONDUCTOR DIES
#12 | 2023-11-30LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTRONIC DEVICE
#13 | 2023-11-02Three dimensional package for semiconductor devices and external components
#14 | 2023-08-31EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING
#15 | 2023-08-17FRONT SIDE LASER-BASED WAFER DICING
#16 | 2023-03-02Wafer chip scale packages with visible solder fillets
#17 | 2023-01-05Zinc Layer For A Semiconductor Die Pillar
#18 | 2022-12-29SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY
#19 | 2022-12-22Semicondutor package substrate with die cavity and redistribution layer
#20 | 2022-12-01Method of forming brass-coated metals in flip-chip redistribution layers
#21 | 2022-10-20IC having a metal ring thereon for stress reduction
#22 | 2022-10-13Efficient redistribution layer topology
#23 | 2022-09-08Integrated system-in-package with radiation shielding
#24 | 2022-06-30Three dimensional package for semiconductor devices and external components
#25 | 2022-06-02MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
#26 | 2022-05-19Flipchip package with an IC having a covered cavity comprising metal posts
#27 | 2022-05-19Miniature sensor cavities
#28 | 2022-03-03Coated semiconductor dies
#29 | 2022-02-24Electronic devices in semiconductor package cavities
#30 | 2022-01-06SEMICONDUCTOR DIE WITH CONVERSION COATING
#31 | 2021-12-23Semiconductor package including undermounted die with exposed backside metal
#32 | 2021-12-09Efficient redistribution layer topology
#33 | 2021-10-21Integrated system-in-package with radiation shielding
#34 | 2021-09-09Zinc-cobalt barrier for interface in solder bond applications
#35 | 2021-08-05Nickel alloy for semiconductor packaging
#36 | 2021-07-08CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS
#37 | 2021-07-08Integrated circuit with metal stop ring outside the scribe seal
#38 | 2021-06-24Brass-coated metals in flip-chip redistribution layers
#39 | 2021-06-17IC having a metal ring thereon for stress reduction
#40 | 2021-05-06Conductive members for die attach in flip chip packages
#41 | 2021-03-04Interconnect for electronic device
#42 | 2021-01-28Contact with bronze material to mitigate undercut
#43 | 2020-12-31Semiconductor die with conversion coating
#44 | 2020-11-19Plating for thermal management
#45 | 2020-10-08MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
#46 | 2020-08-20Semiconductor package with leadframe having pre-singulated leads or lead terminals
#47 | 2020-08-06Nanostructure barrier for copper wire bonding
#48 | 2020-07-02Interconnect for electronic device
#49 | 2020-06-11Semiconductor device with electroplated die attach
#50 | 2020-06-11Die attach surface copper layer with protective layer for microelectronic devices
#51 | 2020-06-04Front side laser-based wafer dicing
#52 | 2020-05-21Plating for thermal management
#53 | 2020-02-13Zinc-cobalt barrier for interface in solder bond applications
#54 | 2020-01-16ALLOY DIFFUSION BARRIER LAYER
#55 | 2020-01-09Semiconductor device with electroplated die attach
#56 | 2020-01-02Contact fabrication to mitigate undercut
#57 | 2019-10-22Zinc-cobalt barrier for interface in solder bond applications
#58 | 2019-08-22Nickel alloy for semiconductor packaging
#59 | 2019-04-11Multilayers of nickel alloys as diffusion barrier layers
#60 | 2019-04-11Die attach surface copper layer with protective layer for microelectronic devices
#61 | 2019-04-11Zinc layer for a semiconductor die pillar
#62 | 2019-03-21Alloy diffusion barrier layer
#63 | 2019-03-21Nanostructure barrier for copper wire bonding
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