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Inventor profile of:

Hisashi KOBUKE

City:

Country:

United States

Published Applications:

1

Last publication date:

2019-03-21

Recent patent applications by KOBUKE Hisashi

Hisashi KOBUKE from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-03-21

US20190089044A1

MULTILAYER INTERCONNECTION SUBSTRATE FOR HIGH FREQUENCY AND MANUFACTURING METHOD THEREOF

InventorID:

2461727 ⎘