Jun OTSUKA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2022-10-06

Top Assignees for applications by Jun OTSUKA

The entities that hold a legal rights for patent applications filed by inventor OTSUKA Jun:

SUMITOMO ELECTRIC INDUSTRIES, LTD. 5 Osaka, Japan
UNIVERSITY OF TSUKUBA 3 Tsukuba, Japan
Sumitomo Electric Industries, Ltd. 3 Osaka-shi, Osaka, Japan
UNIVERSITY OF TSUKUBA 3 Tsukuba-shi, Ibaraki, Japan

Recent patent applications by OTSUKA Jun

Jun OTSUKA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-10-06

US20220315427A1

Chemistry; metallurgy

Carbon nanotube assembled wire and carbon nanotube assembled wire bundle

#2 | 2022-05-19

US20220153585A1

Chemistry; metallurgy

Method for manufacturing carbon nanotube, method for manufacturing carbon nanotube assembled wire, method for manufacturing carbon nanotube assembled wire bundle, carbon nanotube manufacturing apparatus, carbon nanotube assembled wire manufacturing apparatus, and carbon nanotube assembled wire bundle manufacturing apparatus

#3 | 2022-03-03

US20220064003A1

Chemistry; metallurgy

#4 | 2021-01-14

US20210012928A1

Electricity

Multicore cable

#5 | 2019-03-28

US20190094649A1

Physics

Mach-zehnder modulator

InventorID:

2466335 ⎘