Sungjun Im

City:

San Jose, California

Country:

United States

Published Applications:

Last publication date:

2025-11-20

Top Assignees for applications by Sungjun Im

The entities that hold a legal rights for patent applications filed by inventor Im Sungjun:

Sungjun Im from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:

CHIP PACKAGE ASSEMBLY WITH SURFACE MOUNTED COMPONENT PROTECTION

INTEGRATED CIRCUIT DEVICE WITH RAISED LID ATTACH AREA

System and method to enhance reliability in connection with arrangements including circuits

System and method to enhance solder joint reliability

System and method to enhance solder joint reliability

InventorID:

2467993 ⎘