TEIJIN LIMITED

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2013-05-16

Top Assignees for applications by TEIJIN LIMITED

The entities that hold a legal rights for patent applications filed by inventor TEIJIN LIMITED:

TEIJIN LIMITED from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Carbon fiber bundle, method for producing the same, and molded article made thereof

InventorID:

247237 ⎘