Benjamin J. Bending

City:

St. Paul, Minnesota

Country:

United States

Published Applications:

Last publication date:

2023-12-21

Top Assignees for applications by Benjamin J. Bending

The entities that hold a legal rights for patent applications filed by inventor Bending Benjamin J.:

3M INNOVATIVE PROPERTIES COMPANY 3 St. Paul, MN United States

Recent patent applications by Bending Benjamin J.

Benjamin J. Bending from St. Paul, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-12-21

US20230407136A1

Chemistry; metallurgy

Adjustable hybrid PSA/structural adhesive bonds by patterned surface-initiated cure

#2 | 2022-07-07

US20220213358A1

Chemistry; metallurgy

Polyisobutylene adhesive comprising multifunctional component with (meth)acryl or vinyl ether groups

#3 | 2021-04-08

US20210102094A1

Chemistry; metallurgy

PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS

#4 | 2019-05-02

US20190131570A1

Electricity

ORGANIC LIGHT EMITTING DIODE CUSHING FILM

#5 | 2019-04-11

US20190106603A1

Chemistry; metallurgy

Adhesive and damping film

InventorID:

2476010 ⎘