Kimmo KAIJA

City:

Espoo

Country:

Finland

Published Applications:

Last publication date:

2025-11-27

Top Assignees for applications by Kimmo KAIJA

The entities that hold a legal rights for patent applications filed by inventor KAIJA Kimmo:

Kimmo KAIJA from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

COMPONENT WITH IMPROVED ADHESIVE BLEED-OUT CLEARANCE

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT WITH MOULDED PACKAGE

Mechanical support within moulded chip package

Electronic component with metallic cap

Reducing crosstalk in a mixed-signal multi-chip MEMS device package

EMC PROTECTION OF A SEMICONDUCTOR COMPONENT

REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD

InventorID:

2480288 ⎘