Daisuke SASANO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-10-03

Top Assignees for applications by Daisuke SASANO

The entities that hold a legal rights for patent applications filed by inventor SASANO Daisuke:

Daisuke SASANO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

InventorID:

2481850 ⎘