Austin, Texas
United States
22
2019-06-06
The entities that hold a legal rights for patent applications filed by inventor Walls Lloyd A.:
Lloyd A. Walls from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
High speed chip substrate test fixture
#2 | 2018-02-15Noise modulation for on-chip noise measurement
#3 | 2018-02-08Method and apparatus for virtual braille keyboard
#4 | 2017-01-03Impedance matching system for DDR memory
#5 | 2016-04-28Method for performing frequency band splitting
#6 | 2016-04-28Method for performing frequency band splitting
#7 | 2015-10-01Noise modulation for on-chip noise measurement
#8 | 2015-10-01Noise modulation for on-chip noise measurement
#9 | 2014-08-14Reduced wiring requirements with signal slope manipulation
#10 | 2014-06-19Plating Stub Resonance Shift with Filter Stub Design Methodology
#11 | 2014-03-20Multi-level connector and use thereof that mitigates data signaling reflections
#12 | 2013-12-12Multi-level connector and use thereof that mitigates data signaling reflections
#13 | 2013-12-12Plating Stub Resonance Shift with Filter Stub Design Methodology
#14 | 2013-11-28Fabrication method for circuit substrate having post-fed die side power supply connections
#15 | 2013-01-10Reduced wiring requirements with signal slope manipulation
#16 | 2012-07-05Continuously referencing signals over multiple layers in laminate packages
#17 | 2011-07-21Multi-layered thermal sensor for integrated circuits and other layered structures
#18 | 2010-12-30Fabrication method for circuit substrate having post-fed die side power supply connections
#19 | 2010-08-05Reduced wiring requirements with signal slope manipulation
#20 | 2009-10-15Continuously referencing signals over multiple layers in laminate packages
#21 | 2009-08-13Circuit substrate having post-fed die side power supply connections
#22 | 2008-04-24Continuously Referencing Signals over Multiple Layers in Laminate Packages
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