Chi-Hui Lai

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2026-03-19

Top Assignees for applications by Chi-Hui Lai

The entities that hold a legal rights for patent applications filed by inventor Lai Chi-Hui:

Chi-Hui Lai from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR DEVICE AND BONDING FAILURE TEST METHOD THEREOF

GALVANIC EFFECT MONITOR TEST STRUCTURE FOR IC PACKAGE INTERPOSER

Package structure, package-on-package structure and method of fabricating the same

Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device

InventorID:

2490141 ⎘