Daichi Dojima

City:

Sanda-shi

Country:

Japan

Published Applications:

Last publication date:

2025-06-12

Top Assignees for applications by Daichi Dojima

The entities that hold a legal rights for patent applications filed by inventor Dojima Daichi:

Daichi Dojima from Sanda-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR SUPPRESSING FORMATION OF STACKING FAULT, STRUCTURE PRODUCED BY THIS METHOD, AND METHOD FOR EVALUATING AFFECTED LAYER

METHOD FOR REDUCING STACKING FAULTS IN SILICON CARBIDE, AND STRUCTURE CREATED BY MEANS OF SAID METHOD

METHOD FOR ACHIEVING UNIFORM CARRIER CONCENTRATION IN EPITAXIAL LAYER, AND STRUCTURE CREATED BY MEANS OF SAID METHOD

Method for producing SiC substrate provided with graphene precursor and method for surface treating SiC substrate

InventorID:

2494535 ⎘