Hsinchu
Taiwan
14
2026-03-05
The entities that hold a legal rights for patent applications filed by inventor Lin Ming-Hsien:
Ming-Hsien Lin from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
#2 | 2026-02-19PHYSICAL VAPOR DEPOSITION APPARATUS
#3 | 2026-01-15SEMICONDUCTOR DEVICE WITH CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#4 | 2025-10-16Threshold Voltage Tuning for Fin-Based Integrated Circuit Device
#5 | 2025-02-20METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
#6 | 2024-12-19INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME
#7 | 2024-11-21SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE SAME
#8 | 2024-10-31PHYSICAL VAPOR DEPOSITION APPARATUS
#9 | 2024-03-14ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE
#10 | 2023-02-23SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE SAME
#11 | 2022-12-22INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
#12 | 2022-08-11Threshold Voltage Tuning for Fin-Based Integrated Circuit Device
#13 | 2019-05-09Threshold voltage tuning for fin-based integrated circuit device
#14 | 2019-05-09Threshold voltage tuning for fin-based integrated circuit device
2497331 ⎘