Di CHEN

City:

Kanata

Country:

Canada

Published Applications:

Last publication date:

2024-06-27

Top Assignees for applications by Di CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Di:

Di CHEN from Kanata, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED SOLDER RELIABILITY

DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES

Direct-drive D-mode GaN half-bridge power module

Enhanced performance hybrid three-level inverter/rectifier

GaN transistor with integrated drain voltage sense for fast overcurrent and short circuit protection

InventorID:

2497917 ⎘