Ludwigshafen
Germany
15
2024-08-22
The entities that hold a legal rights for patent applications filed by inventor KLIPP Andreas:
Andreas KLIPP from Ludwigshafen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON
#2 | 2024-03-21COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING A LAYER COMPRISING AN ALUMINIUM COMPOUND IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER AND/OR COBALT
#3 | 2023-10-26Composition, Its Use And A Process For Removing Post-Etch Residues
#4 | 2023-10-12Composition, Its Use And A Process For Selectively Etching Silicon-Germanium Material
#5 | 2023-08-31Composition Comprising a Siloxane and an Alkane for Avoiding Pattern Collapse When Treating Patterned Materials with Line-Space Dimensions of 50 NM or Below
#6 | 2023-07-27Use of a Composition Consisting of Ammonia and an Alkanol for Avoiding Pattern Collapse When Treating Patterned Materials with Line-Space Dimensions of 50 NM or Below
#7 | 2023-06-01Composition comprising a primary and a secondary surfactant, for cleaning or rinsing a product
#8 | 2022-07-14COMPOSITION AND PROCESS FOR ELECTIVELY ETCHING A HARD MASK AND/OR AN ETCH-STOP LAYER IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER, COBALT AND/OR TUNGSTEN
#9 | 2022-06-02COMPOSITION COMPRISING AN AMMONIA-ACTIVATED SILOXANE FOR AVOIDING PATTERN COLLAPSE WHEN TREATING PATTERNED MATERIALS WITH LINE-SPACE DIMENSIONS OF 50 NM OR BELOW
#10 | 2021-09-30Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process
#11 | 2021-06-24Imidazolidinethione-containing compositions for post-ash residue removal and/or for oxidative etching of a layer or mask comprising TiN
#12 | 2021-06-03Cleavable additives for use in a method of making a semiconductor substrate
#13 | 2020-10-29COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING A LAYER COMPRISING AN ALUMINIUM COMPOUND IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER AND/OR COBALT
#14 | 2020-08-13Use of compositions comprising a siloxane-type additive for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below
#15 | 2019-05-16Composition for post chemical-mechanical-polishing cleaning
2501319 ⎘