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Inventor profile of:

Vinh Lam

City:

Dublin, California

Country:

United States

Published Applications:

8

Last publication date:

2025-05-22

Top Assignees for applications by Vinh Lam

The entities that hold a legal rights for patent applications filed by inventor Lam Vinh:

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 7 Hsinchu, Taiwan

Recent patent applications by Lam Vinh

Vinh Lam from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-22
US20250169373A1
Electricity

MTJ DEVICE PERFORMANCE BY ADDING STRESS MODULATION LAYER TO MTJ DEVICE STRUCTURE

#2 | 2023-11-16
US20230371398A1
Electricity

MTJ device performance by adding stress modulation layer to MTJ device structure

#3 | 2023-04-06
US20230107977A1
Electricity

MTJ device performance by controlling device shape

#4 | 2022-12-01
US20220384713A1
Electricity

MTJ device performance by adding stress modulation layer to mtj device structure

#5 | 2021-06-24
US20210193915A1
Electricity

MTJ device performance by controlling device shape

#6 | 2020-03-05
US20200075844A1
Electricity

MTJ device performance by adding stress modulation layer to MTJ device structure

#7 | 2019-11-07
US20190341542A1
Electricity

Method for fabricating a magnetic tunneling junction (MTJ) structure

#8 | 2019-05-16
US20190148630A1
Electricity

MTJ device performance by controlling device shape

InventorID:

2504640 ⎘

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