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Inventor profile of:

James E. Benedict

City:

Lowell, Massachusetts

Country:

United States

Published Applications:

27

Last publication date:

2023-06-29

Top Assignees for applications by James E. Benedict

The entities that hold a legal rights for patent applications filed by inventor Benedict James E.:

RAYTHEON COMPANY 21 Waltham, MA United States
Raytheon Company 1 Tewksbury, MA United States

Recent patent applications by Benedict James E.

James E. Benedict from Lowell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-06-29

US20230209728A1

METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING SLOTTED LAYERS

#2 | 2023-04-20

US20230121347A1

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

#3 | 2022-08-18

US20220264745A1

Method for manufacturing non-planar arrays with a single flex-hybrid circuit card

#4 | 2022-05-05

US20220140485A1

Spiral antenna and related fabrication techniques

#5 | 2022-02-17

US20220052460A1

Low profile phased array

#6 | 2021-12-23

US20210400820A1

PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONICS AND ENHANCED VIA RELIABILITY

#7 | 2021-11-25

US20210368629A1

Method for fabricating Z-axis vertical launch

#8 | 2021-11-18

US20210360772A1

PCB cavity mode suppression

#9 | 2021-09-30

US20210305187A1

Process for removing bond film from cavities in printed circuit boards

#10 | 2021-05-20

US20210151855A1

Advanced communications array

#11 | 2021-05-13

US20210144892A1

Printed circuit board automated layup system

#12 | 2021-05-13

US20210144864A1

Method for forming channels in printed circuit boards by stacking slotted layers

#13 | 2021-02-25

US20210059043A1

Method of manufacturing radio frequency interconnections

#14 | 2021-02-18

US20210051805A1

Apparatus for fabricating Z-axis vertical launch within a printed circuit board

#15 | 2020-12-17

US20200395651A1

Interlocking modular beamformer

#16 | 2020-11-19

US20200367357A1

FLAT-WIRE COPPER VERTICAL LAUNCH MICROWAVE INTERCONNECTION METHOD

#17 | 2020-04-21

US16576895

Additive manufacturing technology (AMT) inverted pad interface

#18 | 2020-01-23

US20200028257A1

Millimeter wave phased array

#19 | 2019-11-21

US20190357363A1

Additive manufactured reactive beamformer

#20 | 2019-08-29

US20190269021A1

Additive manufacturing technology (AMT) low profile signal divider

#21 | 2019-08-29

US20190269007A1

SNAP-RF interconnections

#22 | 2019-05-16

US20190150296A1

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

#23 | 2019-05-16

US20190150271A1

Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion

#24 | 2019-05-16

US20190148837A1

Additive manufacturing technology (AMT) low profile radiator

#25 | 2019-05-16

US20190148832A1

Spiral antenna and related fabrication techniques

#26 | 2019-05-16

US20190148828A1

Low profile phased array

#27 | 2019-05-16

US20190148807A1

Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line

InventorID:

2504767 ⎘