Tainan
Taiwan
32
2024-11-14
The entities that hold a legal rights for patent applications filed by inventor WANG Yu Shih:
Yu Shih WANG from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING DEPOSITION
#2 | 2024-04-25METHOD OF BREAKING THROUGH ETCH STOP LAYER
#3 | 2024-03-21SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4 | 2023-12-28DEVICE WITH MODIFIED WORK FUNCTION LAYER AND METHOD OF FORMING THE SAME
#5 | 2023-11-16Conductive feature formation and structure
#6 | 2023-06-22SEMICONDUCTOR STRUCTURE
#7 | 2023-05-25Wet Cleaning with Tunable Metal Recess for Via Plugs
#8 | 2023-02-09Semiconductor device and method of manufacture
#9 | 2022-12-08Conductive feature of a semiconductor device
#10 | 2022-11-17Semiconductor device and method
#11 | 2022-11-17Semiconductor device and method of manufacture
#12 | 2022-11-10Method for processing substrate
#13 | 2022-09-08Conductive feature of a semiconductor device and method of forming same
#14 | 2022-06-02Method of breaking through etch stop layer
#15 | 2022-02-17Connecting structure and method for forming the same
#16 | 2021-12-02Semiconductor device and method of forming same
#17 | 2021-11-25Substrate processing apparatus and method for processing substrate
#18 | 2021-10-21Method for forming semiconductor device that includes covering metal gate with multilayer dielectric
#19 | 2021-07-22Conductive feature formation and structure
#20 | 2021-07-01Semiconductor device and manufacturing method thereof
#21 | 2021-07-01Semiconductor device and method
#22 | 2021-07-01Method of breaking through etch stop layer
#23 | 2021-06-24Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
#24 | 2021-05-06Wet cleaning with tunable metal recess for via plugs
#25 | 2021-05-06Semiconductor device and method of manufacture using a contact etch stop layer (CESL) breakthrough process
#26 | 2020-12-24Contact structure and method of fabricating the same
#27 | 2019-10-03Wet cleaning with tunable metal recess for VIA plugs
#28 | 2019-09-19Conductive feature formation and structure using bottom-up filling deposition
#29 | 2019-05-30Conductive feature formation and structure
#30 | 2019-05-30Conductive feature formation and structure
#31 | 2018-10-25Contact structure and method of fabricating the same
#32 | 2018-05-31Contact structure and method of fabricating the same
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