Kensuke IDE

City:

Ritto-shi

Country:

Japan

Published Applications:

Last publication date:

2019-06-06

Top Assignees for applications by Kensuke IDE

The entities that hold a legal rights for patent applications filed by inventor IDE Kensuke:

Kensuke IDE from Ritto-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SUBSTRATE JOINING METHOD

Room temperature bonding apparatus

Room-temperature bonding method and room-temperature bonding apparatus including sputtering

Room temperature bonding machine and room temperature bonding method

Room temperature bonding apparatus

DEVICE AND DEVICE MANUFACTURE METHOD

Room temperature bonding using sputtering

InventorID:

2523987 ⎘