Daisuke HOSOI

City:

Chiba

Country:

Japan

Published Applications:

Last publication date:

2019-06-20

Recent patent applications by HOSOI Daisuke

Daisuke HOSOI from Chiba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

ABRASIVE GRAINS, MANUFACTURING METHOD THEREFOR, POLISHING SLURRY CONTAINING SAID ABRASIVE GRAINS, AND POLISHING METHOD USING SAID POLISHING SLURRY

InventorID:

2533222 ⎘