Ko Inaba

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2021-10-14

Top Assignees for applications by Ko Inaba

The entities that hold a legal rights for patent applications filed by inventor Inaba Ko:

Ko Inaba from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Solder joint

Flux and solder paste

Solder bonding method and solder joint

Lead-free solder paste and its use

Method of Soldering a Module Board

InventorID:

2540515 ⎘