Tetsu Takemasa

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-08-21

Top Assignees for applications by Tetsu Takemasa

The entities that hold a legal rights for patent applications filed by inventor Takemasa Tetsu:

Tetsu Takemasa from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

FLUX AND SOLDER PASTE

FLUX AND SOLDER PASTE

Solder joint

Electrically conductive paste and sintered body

Metallic sintered bonding body and die bonding method

Solder bonding method and solder joint

InventorID:

2540516 ⎘