Tokyo
Japan
11
2019-01-10
The entities that hold a legal rights for patent applications filed by inventor SEIKE Hideyuki:
Hideyuki SEIKE from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for producing semiconductor chip
#2 | 2018-09-06Method for producing semiconductor package
#3 | 2017-11-14Method for producing semiconductor package
#4 | 2014-02-27Terminal structure, and semiconductor element and module substrate comprising the same
#5 | 2014-02-27Terminal structure, and semiconductor element and module substrate comprising the same
#6 | 2014-02-27Terminal structure and semiconductor device
#7 | 2014-02-27Terminal structure and semiconductor device
#8 | 2013-08-01STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME
#9 | 2013-05-30Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
#10 | 2013-05-23Coating and electronic component
#11 | 2013-05-23Coating and electronic component
254908 ⎘