Hiroki Ieda

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2020-04-23

Top Assignees for applications by Hiroki Ieda

The entities that hold a legal rights for patent applications filed by inventor Ieda Hiroki:

Hiroki Ieda from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic Device, Cover Seal and Method for Applying Cover Seal

Pressure-Sensitive Adhesive Sheet and Use Thereof

Pressure-sensitive adhesive sheet and magnetic disc device

InventorID:

2551550 ⎘