DesPlaines, Illinois
United States
6
2023-07-13
The entities that hold a legal rights for patent applications filed by inventor Lui Kai C.:
Kai C. Lui from DesPlaines, US has applied for patents for these inventions. The list has both pending applications and granted patents:
High density fiber enclosure and method
#2 | 2021-11-18High density fiber enclosure and method
#3 | 2020-11-26High density fiber enclosure and method
#4 | 2019-10-03High density fiber enclosure and method
#5 | 2019-09-26High density fiber enclosure and method
#6 | 2019-07-18High density fiber enclosure and method
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